Combination ICs - Understanding the Needs of Tomorrow - Today! - 15 December 2008
The inclusion of multiple wireless technologies on a single IC is becoming increasingly widespread. As the drive for reduced power consumption, additional functionality and significant cost reduction reaches a crescendo, it has never been a more exciting time for combination ICs. Broadcom’s recently announced 802.11n WiFi, Bluetooth, and FM combination (which follows the company’s intent to introduce a new combination IC every 60 days over the coming months), has ensured this issue remains a hot topic.
The wireless industry is moving at an amazingly quick pace and a lot has changed since IMS Research published its first combination IC report. The inclusion of IEEE 802.11 (WLAN) as an option for Bluetooth high speed has contributed to reduced momentum for UWB (ECMA-386), as evidenced by the loss of support from both industry heavyweight Intel and prominent start-up WiQuest. The inclusion of 802.11 into Bluetooth high speed, WiBree into the Bluetooth low energy specification, and the consolidation experienced in various technology markets (such as GPS) means that certain companies not previously anticipated to include such technologies in a single IC are more likely to do so in the future. Lisa Arrowsmith, Research Analyst with IMS commented, “The combination of such factors means that the future will bring increasingly more chipsets that include several wireless solutions.”
The future for ICs with multiple wireless functionality is by no means straightforward – the crux of the issue is trying to conclude which technologies to integrate, to best satisfy the needs of which applications. Technologies with a similar attach rates and specification maturity levels appear to be well suited. This seems straight-forward enough… doesn’t it? Yet this is exactly where the difficulties associated with deciding which combinations to invest in are conceived. Given the expansive time it can take from idea conception through to end-device shipment there is a strong likelihood that these attach rates and spec maturity levels will have changed.
Indeed, it may be that companies who foresee the future needs of end-users and creatively combine technologies into unique ICs could be most successful going forward. In contrast, companies currently designing products for ‘today’s users’ may completely miss out on the market for ‘tomorrow’s consumers’. This is why it is so important that companies are able to accurately anticipate future customer requirements, technology developments and market changes.
Notes for Editors
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IMS Research is a supplier of market research and consultancy services on a wide range of global electronics markets. The company is supported by headquarters in Wellingborough, UK and offices in Austin, Texas and Shanghai, China. IMS Research regularly publishes detailed research on Connectivity markets, among others.